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Removal of encapsulating materialsTechniques involving softening or dissolving of potting materials leaves electronics unaffected. Procedure may be used with almost any solvent or plastic within acceptable temperature and pressure ranges.
Document ID
19760000143
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Jacobs, G. L. (Sperry Rand Corp.)
Date Acquired
August 8, 2013
Publication Date
August 1, 1976
Publication Information
Publication: NASA Tech Briefs
Volume: 1
Issue: 2
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
GSC-11696
ISSN: 0145-319X
Report Number: GSC-11696
Accession Number
76B10143
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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