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Guidelines for multiple LSI packagingHandbook provides specific guidelines related to ceramic multilayer circuit fabrication in terms of packaging density and interconnection methods, guiding the designer from initial stages of ceramic multilayer interconnection and artwork generation through test pattern utilization, assembly operations, and final inspection and test procedures.
Document ID
19760000159
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Peckinpaugh, C. J. (Electron. Commun., Inc.)
Date Acquired
August 8, 2013
Publication Date
August 1, 1976
Publication Information
Publication: NASA Tech Briefs
Volume: 1
Issue: 2
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-23367
ISSN: 0145-319X
Report Number: MFS-23367
Accession Number
76B10159
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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