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Transducer bonding kitInexpensive kit improves bond quality, saves time, and is used in hard-to-reach areas. Kit provides precise pressure loading, and allows pressure to be monitored during curing cycle.
Document ID
19760000587
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Roush, R. M., Jr. (Rockwell Intern. Corp.)
Lott, D. A. (Rockwell Intern. Corp.)
Keir, A. R. (Rockwell Intern. Corp.)
Date Acquired
August 8, 2013
Publication Date
March 1, 1977
Publication Information
Publication: NASA Tech Briefs
Volume: 1
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-19690
Report Number: MSC-19690
ISSN: 0145-319X
Accession Number
76B10587
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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