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Testing of printed circuit board solder joints by optical correlationAn optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.
Document ID
19760004768
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Technical Report (TR)
Authors
Espy, P. N. (NASA Marshall Space Flight Center Huntsville, AL, United States)
Date Acquired
September 3, 2013
Publication Date
November 1, 1975
Subject Category
Optics
Report/Patent Number
M-153
NASA-TR-R-449
Report Number: M-153
Report Number: NASA-TR-R-449
Accession Number
76N11856
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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