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Vacuum soldering a metalized ceramic to a metal carrierUsing vacuum-soldering method, attachments that are 85 to 95 percent void free can be made. Method is useful for various large scale substrate attachment processes in microelectronic industry.
Document ID
19770000435
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Gallagher, B. D.
Kermode, A. W.
Mayne, R. C.
Date Acquired
August 8, 2013
Publication Date
March 1, 1978
Publication Information
Publication: NASA Tech Briefs
Volume: 2
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
NPO-14037
ISSN: 0145-319X
Report Number: NPO-14037
Accession Number
77B10435
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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