Evaluation testing of solid encapsulated microcircuits for space applications

Epoxy encapsulated microcircuits were subjected to various thermal, vibration, thermal cycling, and reduced barometric pressure stress tests to obtain electrical, environmental, and failure data. Analyses of the data were employed to derive information on environmental and operating design limits to determine the capability of encapsulated microcircuits to perform in space applications and environments. Seven different part types (four TTL, two CMOS, one linear) from five different manufacturers were subjected to single, multiple, and combinational environmental stress levels to determine: (1) what failure mechanisms are unique to encapsulated microcircuits; (2) how believable are suppliers claims of improved reliability, (3) what stress tests and screens can be used to identify potential early failure, and (4) what stress tests and screens should be avoided to prevent unwanted life degradation.