NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login

Press Enter or click the Search button to begin your search.

Back to Results
Bimetallic junctionsThe formation of voids through interdiffusion in bimetallic welded structures exposed to high operating temperatures is inhibited by utilizing an alloy of the parent materials in the junction of the parent materials or by preannealing the junction at an ultrahigh temperature. These methods are also used to reduce the concentration gradient of a hardening agent.
Document ID
19770021321
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Arcella, F. G. (Westinghouse Corp Pittsburgh, United States)
Lessmann, G. G. (Westinghouse Corp Pittsburgh, United States)
Lindberg, R. A. (NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
September 3, 2013
Publication Date
July 5, 1977
Subject Category
Metallic Materials
Report/Patent Number
Patent Number: NASA-CASE-LEW-11573-1
Patent Number: US-PATENT-4,033,504
Patent Application Number: US-PATENT-APPL-SN-625733
Accession Number
77N28265
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LEW-11573-1|US-PATENT-4,033,504
Patent Application
US-PATENT-APPL-SN-625733

Related Records

IDRelationTitleN76-13267Superseded By
No Preview Available