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Eliminating gold migration in microcircuitsReport discusses how effects of moisture and other factors causing bridging between conductors can be prevented. Study details how several factors such as contaminants, large packages, high voltage, narrow conductor spacing and temperature contribute to moisture problems.
Document ID
19780000462
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Dermarderosian, A. (Raytheon Co.)
Murphy, C. R. (Rockwell Intern. Corp.)
Date Acquired
August 9, 2013
Publication Date
March 1, 1979
Publication Information
Publication: NASA Tech Briefs
Volume: 3
Issue: 4
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
MSC-18213
ISSN: 0145-319X
Report Number: MSC-18213
Accession Number
78B10462
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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