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Sealing microcircuits with adhesivesReport describes study of adhesive-sealed packages for hybrid microcircuits. Ten commercially available adhesives were used to seal metal and ceramic packages and were tested for moisture resistance at high humidity.
Document ID
19780000592
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Licari, J. J. (Rockwell Intern. Corp.)
Perkins, K. L. (Rockwell Intern. Corp.)
Date Acquired
August 9, 2013
Publication Date
March 1, 1979
Publication Information
Publication: NASA Tech Briefs
Volume: 3
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MFS-23869
Report Number: MFS-23869
ISSN: 0145-319X
Accession Number
78B10592
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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