Polyimide adhesives

A process was developed for preparing aromatic polyamide acids for use as adhesives by reacting an aromatic dianhydride to an approximately equimolar amount of an aromatic diamine in a water or lower alkanol miscible ether solvent. The polyamide acids are converted to polyimides by heating to the temperature range of 200 - 300 C. The polyimides are thermally stable and insoluble in ethers and other organic solvents.