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Integral glass encapsulation for solar arraysElectrostatic bonding has been used to join silicon solar cells to borosilicate glass without the aid of any organic binders or adhesives. The results of this investigation have been to demonstrate, without question, the feasibility of this process as an encapsulation technique. The potential of ESB for terrestrial solar arrays was clearly shown. The process is fast, reproducible, and produces a permanent bond between glass and silicon that is stronger than the silicon itself. Since this process is a glass sealing technique requiring no organics it makes moisture tight sealing of solar cells possible.
Document ID
19780016692
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Young, P. R.
(Spire Corp. Bedford, MA, United States)
Date Acquired
September 3, 2013
Publication Date
November 1, 1977
Subject Category
Energy Production And Conversion
Report/Patent Number
IR-10046-1
NASA-CR-157091
DOE/JPL-954521-77/3
Report Number: IR-10046-1
Report Number: NASA-CR-157091
Report Number: DOE/JPL-954521-77/3
Accession Number
78N24635
Funding Number(s)
CONTRACT_GRANT: JPL-954521
CONTRACT_GRANT: NAS7-100
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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