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Moisture penetration in microcircuit packagesResults of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.
Document ID
19790000315
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Licari, J. J. (Rockwell International Corp.)
Perkins, K. L. (Rockwell International Corp.)
Date Acquired
August 10, 2013
Publication Date
April 1, 1980
Publication Information
Publication: NASA Tech Briefs
Volume: 4
Issue: 3
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-25087
ISSN: 0145-319X
Report Number: MFS-25087
Accession Number
79B10315
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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