Array Automated Assembly, Phase 2

The baseline process sequence using nontextured square wafers was integrated. Difficulties encountered include: (1) replacement of the N-250 spray on diffusion source with PX-10 source; and (2) modification of the firing for printed silver and aluminum contracts is required to accommodate the change of wafer size and shape. Results indicate that the cells processed through the entire process sequence except laser scribe and spray on AR coating indicate the process sequence is feasible. Greater cell conversion efficiency is presented.