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Room-temperature adhesive for high-temperature usePPQ (polyphenylquinoxaline) cures at room temperature, but withstands temperatures between -186 and +402 deg C. Adhesive is applied in chloroform solution. Bond forms as solvent evaporates.
Document ID
19800000129
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Brooks, J. L. (Rockwell International Corp.)
Hill, W. L. (Rockwell International Corp.)
Rousseau, C. R. (Rockwell International Corp.)
Date Acquired
August 10, 2013
Publication Date
August 1, 1980
Publication Information
Publication: NASA Tech Briefs
Volume: 5
Issue: 1
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-16930
ISSN: 0145-319X
Report Number: MSC-16930
Accession Number
80B10129
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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