Method and apparatus for slicing crystals

The crystal slicing method is described as follows. A crystal is sliced in a plane parallel to flat, opposed parallel end faces of the crystal. The end faces of the crystal are gripped by a pair of opposed, perforated platens of a pair of vacuum chambers, one of which is translatable relative to the other. A blade cuts the crystal through the desired plane. A spring biases one of the vacuum chambers away from the other vacuum chamber while both of the faces are gripped by the vacuum chambers and the blade is cleaving the crystal. A sliced portion of the crystal gripped by one of the vacuum chambers is pulled away from the remainder of the crystal gripped by the second vacuum chamber when the crystal was cleaved by the blade through the plane.