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High-temperature adhesives for bonding polyimide filmExperimental polyimide resins were developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of Kapton/Kapton bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575 K (575 F) in vacuum. Glass transition temperatures of the polyimide/"Kapton" bondlines were monitored by thermomechanical analysis.
Document ID
19800017950
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
St.clair, A. K. (NASA Langley Research Center Hampton, VA, United States)
Slemp, W. S. (NASA Langley Research Center Hampton, VA, United States)
St.clair, T. L. (NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 4, 2013
Publication Date
May 1, 1980
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-TM-81824
Report Number: NASA-TM-81824
Meeting Information
Meeting: Natl. SAMPE Symp.
Location: Anaheim, CA
Country: United States
Start Date: May 1, 1978
Accession Number
80N26449
Funding Number(s)
PROJECT: RTOP 505-33-33-02
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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