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Tool Severs Hidden Adhesive BondsNew tool enters narrow gap between fragile materials and removes adhesively bonded filler without damage to adjacent surfaces. Reaches deep into narrow crevices to reach hidden bond lines. Tool originally developed to remove ceramic filler from between Space Shuttle surface-insulation tiles.
Document ID
19820000322
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Keir, A. R. (Rockwell International Corp.)
Dominguez, X. A. (Rockwell International Corp.)
Date Acquired
August 10, 2013
Publication Date
May 1, 1983
Publication Information
Publication: NASA Tech Briefs
Volume: 7
Issue: 2
ISSN: 0145-319X
Subject Category
Machinery
Report/Patent Number
MSC-20198
ISSN: 0145-319X
Report Number: MSC-20198
Accession Number
82B10322
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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