Proceedings of the Low-Cost Solar Array Wafering WorkshopThe technology and economics of silicon ingot wafering for low cost solar arrays were discussed. Fixed and free abrasive sawing wire, ID, and multiblade sawing, materials, mechanisms, characterization, and innovative concepts were considered.
Document ID
19820015774
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Morrison, A. D. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
IDRelationTitle19820015780WorkAllowable silicon wafer thickness versus diameter for ingot rotation ID wafering19820015779WorkID wafering technology19820015792WorkWafering economies for industrialization from a wafer manufacturer's viewpoint19820015777WorkArco Solar, Incorporated: The industrial point of view19820015797WorkWafering insight provided by the ODE method19820015790WorkSome tradeoffs in ingot shaping and price of solar photovoltaic modules19820015787WorkKinematical and mechanical aspects of wafer slicing19820015796WorkID slicing and the automated factory19820015794WorkSystem for slicing wafers19820015795WorkDiamond Sheet: A new diamond tool material19820015788WorkCorrosion inhibitors for water-base slurry in multiblade sawing19820015793WorkOverview of a new slicing method: Fixed Abrasive Slicing Technique (FAST)19820015776WorkComparison of various silicon sawing methods19820015799WorkFundamental studies of the solid-particle erosion of silicon19820015789WorkField experience with various slicing methods19820015782WorkEffect of lubricant environment on saw damage in silicon wafers19820015786WorkDesign and use of multiple blade slurry sawing in a production atmosphere19820015801WorkStatus of SEMI's solar-grade substrate standards19820015783WorkInfluence of fluids on the abrasion of silicon by diamond19820015784WorkThe uses of Man-Made diamond in wafering applications19820015775WorkLSA project perspective of wafering technology19820015778WorkSome disconnected speculations on slicing silicon19820015781WorkCurrent economic and sensitivity analysis for ID slicing of 4 inch and 6 inch diameter silicon ingots for photovoltaic applications19820015800WorkPre- and post-annealing of mechanical damage in silicon wafers19820015791WorkSensitivity analysis of add-on price estimate for select silicon wafering technologies19820015798WorkExit chipping in ID sawing of silicon crystals19820015785WorkWire blade development for Fixed Abrasive Slicing Technique (FAST) slicing