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LARC-TPI: A multi-purpose thermoplastic polyimideA linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high temperature applications. In its fully imidized form, this material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI was evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100 void-free laminates for flexible circuit applications. The development of LARC-TPI as a potential molding powder, composite matrix resin, high temperature film and fiber is also discussed.
Document ID
19820025654
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
St.clair, A. K. (NASA Langley Research Center Hampton, VA, United States)
St.clair, T. L. (NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 4, 2013
Publication Date
June 1, 1982
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-TM-84516
NAS 1.15:84516
Report Number: NASA-TM-84516
Report Number: NAS 1.15:84516
Accession Number
82N33530
Funding Number(s)
PROJECT: RTOP 505-33-33-02
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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