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Plasma-Sprayed Copper Tie-In for Nickel PlatingFoam insulation nickel-plated with one less step. Changing tie-in layer from plasma-sprayed nickel to plasma-sprayed copper eliminates intermediate copper electroplating step previously required.
Document ID
19830000584
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Lombard, J. W. (Rockwell International Corp.)
Otousa, J. E. (Rockwell International Corp.)
Date Acquired
August 11, 2013
Publication Date
November 1, 1984
Publication Information
Publication: NASA Tech Briefs
Volume: 8
Issue: 2
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
MFS-19481
Report Number: MFS-19481
ISSN: 0145-319X
Accession Number
83B10584
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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