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The development of aerospace polyimide adhesivesFew materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.
Document ID
19830009442
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
St.clair, A. K.
(NASA Langley Research Center Hampton, VA, United States)
St.clair, T. L.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 4, 2013
Publication Date
January 1, 1983
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-TM-84587
NAS 1.15:84587
Report Number: NASA-TM-84587
Report Number: NAS 1.15:84587
Meeting Information
Meeting: Tech. Conf. on Polyimides
Location: Ellenville, NY
Country: United States
Start Date: November 1, 1982
Accession Number
83N17713
Funding Number(s)
PROJECT: RTOP 505-33-33-09
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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