Creep testing of foil-gage metals at elevated temperature using an automated data acquisition system

A method is being developed to obtain creep data on foil gage metals at elevated temperatures using an automated data acquisition system in conjunction with a mechanically counter balanced extensometer. The automated system components include the Hewlett-Packard (HP) 9845A desktop computer, the HP 3455A digital voltmeter and the HP 3495A scanner. Software for test monitoring and data collection was developed; data manipulation, including curve plotting was done with a HP regression analysis software package. Initial creep tests were conducted on .003 in. thick foil specimens of Ti-6A1-4V at temperatures of 800 F and 1000 F and at stress levels of 25 ksi and 45 ksi. For comparison, duplicate tests were run on .049 in. thick specimens sheet of the same alloy. During testing, the furnace and specimen temperature, bridge voltage, strain and load output were automatically monitored and recorded at predetermined intervals. Using the HP regression analysis program, recorded strain output was plotted as a function of time. These resultant creep curves indicate that, under similar conditions of temperature and stress, foil gage specimens exhibit a higher creep rate than sheet specimens.