Development of technologies for welding interconnects to fifty-micron thick silicon solar cells

A program was conducted to develop technologies for welding interconnects to 50 microns thick, 2 by 2 cm solar cells. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 C to -180 C) were performed on 16 cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48 cell modules (one for each cell type) were assembled with 50 microns thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.