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Toughening mechanism in elastometer-modified epoxy resins: Part 1Several plaques of Epon 828, cured with piperidine, modified with hycar(r) CTBN 1300X8, Hycar(R) CTBN 1300X13, and Hycar(R) CTBN 1300x15, and in some cases modified with biphenol A (BPA), yielded properly toughened epoxies with rubber particle diameters ranging from 0.1 to 10 microns. Fracture toughness experiments indicate that toughness was more a function of rubber content than the rubber particle size. Tensile volumetric behavior of the near resin exhibits two regions: an initial region where the increase in volume strain was due to the Poisson's effect, and a second region where a slower rate of increase in volume strain was due to shear deformation. Tensile volumetric deformation of an elastomer-modified epoxy exhibits the same type of behavior to that of the neat resin at low rates ( 3.2x0.01 sec(-1)). But at very high strain rates, which correspond more closely to the strain rates at the crack tip, there exists an increase in volume strain beyond the Poisson's effect. TEM, SEM and OM studies indicate that the rubber particles had voided. When a thin section from the deformed region is viewed under crossed-polarized light, shear bands are seen connecting voided rubber particles. From this information cavitation and enhanced shear band formation is proposed as the toughening mechanism.
Document ID
19830024671
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Yee, A. F.
(General Electric Co. Schenectady, NY, United States)
Pearson, R. A.
(General Electric Co. Schenectady, NY, United States)
Date Acquired
September 4, 2013
Publication Date
August 1, 1983
Publication Information
Publisher: NASA
Subject Category
Nonmetallic Materials
Report/Patent Number
REPT-83-SRD-023-PT-1
NASA-CR-3718
NAS 1.26:3718
Report Number: REPT-83-SRD-023-PT-1
Report Number: NASA-CR-3718
Report Number: NAS 1.26:3718
Accession Number
83N32942
Funding Number(s)
CONTRACT_GRANT: NAS1-16132
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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