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Joining lead wires to thin platinum alloy filmsA two step process of joining a lead wire to .000002 m thick platinum alloy film which rests upon an equally thin alumina insulating layer which is adhered to a metal substrate is described. Typically the platinum alloy film forms part of a thermocouple for measuring the surface temperature of a gas turbine airfoil. In the first step the lead wire is deformed 30 to 60% at room temperature while the characteristic one million ohm resistance of the alumina insulating layer is monitored for degradation. In the second step the cold pressed assembly is heated at 865 to 1025 C for 4 to 75 hr in air. During the heating step any degradation of insulating layer resistance may be reversed, provided the resistance was not decreased below 100 ohm in the cold pressing.
Document ID
19830027067
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Przybyszewski, J. S.
(United Technologies Corp. East Hartford, Conn., United States)
Claing, R. G.
(United Technologies Corp. East Hartford, Conn., United States)
Date Acquired
August 11, 2013
Publication Date
September 6, 1983
Subject Category
Instrumentation And Photography
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-212949
Patent Number: NASA-CASE-LEW-13934-1
Patent Number: US-PATENT-4,402,447
Accession Number
83N35338
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LEW-13934-1|US-PATENT-4,402,447
Patent Application
US-PATENT-APPL-SN-212949
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