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Selecting Flatpack Lead-Forming DiesOptical instrument accurately records unformed lead offset for each flatpack and provides better fit of flatpack to printed wiring board.
Document ID
19840000141
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Choate, E. L. (Honeywell, Inc.)
Date Acquired
August 12, 2013
Publication Date
January 1, 1985
Publication Information
Publication: NASA Tech Briefs
Volume: 8
Issue: 3
ISSN: 0145-319X
Subject Category
Mechanics
Report/Patent Number
MFS-25951
Report Number: MFS-25951
ISSN: 0145-319X
Accession Number
84B10141
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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