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Hot melt recharge systemA package assembly is described for pecisely positioning a charge of hot melt adhesive onto an attachment pad or point of use. The adhesive is heated to softening or melt temperature (280 F to 325 F) and thereafter cooled to resolidifying temperature. A single sided pressure sensitive polyimide film tape serves with another film strip to protect a sandwiched adhesive strip until use and to hold the adhesive in precise position until thermally bonded to its point of use. Tab ends serve as aids in stripping tapes and from the adhesive charge.
Document ID
19840006255
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Progar, D. J. (NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 4, 2013
Publication Date
December 13, 1983
Subject Category
Nonmetallic Materials
Report/Patent Number
Patent Number: US-PATENT-4,420,518
Patent Number: NASA-CASE-LAR-12881-1
Patent Application Number: US-PATENT-APPL-SN-361215
Accession Number
84N14323
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-4,420,518|NASA-CASE-LAR-12881-1
Patent Application
US-PATENT-APPL-SN-361215

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