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Flexible substrate for printed wiringA very flexible substrate for printed wiring is disclosed which is composed of a blend of phenoxy resin-polyisocyanate-brominated epoxy resin in which the equivalent ration of the functional groups is hydroxyl grouped: isocyanate group: epoxy group = 1:0.2 to 2:0.5 to 3. The product has outstanding solder resistance and is applied to metal without using adhesives.
Document ID
19840011410
Acquisition Source
Legacy CDMS
Document Type
Other - Other
Authors
Asakura, M.
(NASA Headquarters Washington, DC United States)
Yabe, K.
(NASA Headquarters Washington, DC United States)
Tanaka, H.
(NASA Headquarters Washington, DC United States)
Soda, A.
(NASA Headquarters Washington, DC United States)
Date Acquired
September 4, 2013
Publication Date
July 1, 1982
Subject Category
Composite Materials
Report/Patent Number
NAS 1.15:77459
NASA-TM-77459
Report Number: NAS 1.15:77459
Report Number: NASA-TM-77459
Accession Number
84N19478
Funding Number(s)
CONTRACT_GRANT: NASW-3541
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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