Thermoset-thermoplastic aromatic polyamide containing N-propargyl groups

The compounds of the class of aromatic polyamides useful as matrix resins in the manufacture of composites or laminate fabrication were developed. The process for preparing this thermoplastic-thermoset polyamide system involves incorporating a latent crosslinking moiety along the backbone of the polyamide to improve the temperature range of fabrication thereof wherein the resin softens at a relatively low temperature (approx. 154 C) and subsequently sets-up or undergoes crosslinking when subjected to higher temperature (approx. 280 C).