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Advanced leading edge thermal-structure concept. Direct bond reusable surface insulation to a composite structureAn advanced leading-edge concept was analyzed using the space shuttle leading edge system as a reference model. The comparison indicates that a direct-bond system utilizing a high temperature (2700 F) fibrous refractory composite insulation tile bonded to a high temperature (PI/graphite) composite structure can result in a weight savings of up to 800 lb. The concern that tile damage or loss during ascent would result in adverse entry aerodynamics if a leading edge tile system were used is addressed. It was found from experiment that missing tiles (as many as 22) on the leading edge would not significantly affect the basic force-and-moment aerodynamic coefficients. Additionally, this concept affords a degree of redundancy to a thermal protection system in that the base structure (being a composite material) ablates and neither melts nor burns through when subjected to entry heating in the event tiles are actually lost or damaged during ascent.
Document ID
19840015597
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Riccitiello, S. R.
(NASA Ames Research Center Moffett Field, CA, United States)
Figueroa, H.
(Aerospace Corp. Sunnyvale, Calif., United States)
Coe, C. F.
(Coe Engineering)
Kuo, C. P.
(JPL)
Date Acquired
September 4, 2013
Publication Date
March 1, 1984
Subject Category
Space Transportation
Report/Patent Number
NASA-TM-85941
NAS 1.15:85941
A-9570
Report Number: NASA-TM-85941
Report Number: NAS 1.15:85941
Report Number: A-9570
Accession Number
84N23665
Funding Number(s)
PROJECT: RTOP 506-53-31
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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