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Rapid adhesive bonding conceptsAdhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process is often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid adhesive bonding concepts were developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens are cut by a factor of 10 to 100 compared to standard press bonding. The development of rapid adhesive bonding for lap shear specimens (per ASTM D1003 and D3163), for aerospace panel bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric matrix composite structures are reviewed.
Document ID
19840021899
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Stein, B. A.
(NASA Langley Research Center Hampton, VA, United States)
Tyeryar, J. R.
(NASA Langley Research Center Hampton, VA, United States)
Hodges, W. T.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 4, 2013
Publication Date
June 1, 1984
Subject Category
Composite Materials
Report/Patent Number
NASA-TM-86256
NAS 1.15:86256
Report Number: NASA-TM-86256
Report Number: NAS 1.15:86256
Accession Number
84N29968
Funding Number(s)
PROJECT: RTOP 505-33-33
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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