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Monolithic microwave integrated circuits: Interconnections and packaging considerationsMonolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.
Document ID
19840023391
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Bhasin, K. B. (NASA Lewis Research Center Cleveland, OH, United States)
Downey, A. N. (NASA Lewis Research Center Cleveland, OH, United States)
Ponchak, G. E. (NASA Lewis Research Center Cleveland, OH, United States)
Romanofsky, R. R. (NASA Lewis Research Center Cleveland, OH, United States)
Anzic, G. (NASA Lewis Research Center Cleveland, OH, United States)
Connolly, D. J. (NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
September 4, 2013
Publication Date
January 1, 1984
Subject Category
Communications And Radar
Report/Patent Number
NASA-TM-83774
E-2266
NAS 1.15:83774
Report Number: NASA-TM-83774
Report Number: E-2266
Report Number: NAS 1.15:83774
Meeting Information
Meeting: Ann. Intern. Electron. Packaging Conf.
Location: Baltimore, MD
Country: United States
Start Date: October 29, 1984
End Date: October 31, 1984
Sponsors: International Electronics Packaging Society
Accession Number
84N31461
Funding Number(s)
PROJECT: RTOP 506-58-22
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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