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Electroless-plating technique for fabricating thin-wall convective heat-transfer modelsA technique for fabricating uniform thin-wall metallic heat-transfer models and which simulates a Shuttle thermal protection system tile is described. Two 6- by 6- by 2.5-in. tiles were fabricated to obtain local heat transfer rates. The fabrication process is not limited to any particular geometry and results in a seamless thin-wall heat-transfer model which uses a one-wire thermocouple to obtain local cold-wall heat-transfer rates. The tile is relatively fragile because of the brittle nature of the material and the structural weakness of the flat-sided configuration; however, a method was developed and used for repairing a cracked tile.
Document ID
19840023491
Acquisition Source
Legacy CDMS
Document Type
Technical Publication (TP)
Authors
Avery, D. E.
(NASA Langley Research Center Hampton, VA, United States)
Ballard, G. K.
(NASA Langley Research Center Hampton, VA, United States)
Wilson, M. L.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 4, 2013
Publication Date
August 1, 1984
Subject Category
Fluid Mechanics And Heat Transfer
Report/Patent Number
NAS 1.60:2349
L-15815
NASA-TP-2349
Report Number: NAS 1.60:2349
Report Number: L-15815
Report Number: NASA-TP-2349
Accession Number
84N31561
Funding Number(s)
PROJECT: RTOP 506-51-23-03
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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