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Research pressure instrumentation for NASA Space Shuttle main engine, modification no. 5The advantages of silicon piezoresistive strain sensing technology are being used to achieve the objectives of state of the art pressure sensors for SSME applications. The integration of multiple functions on a single chip is the key attribute being exploited. Progress is reported in transducer packaging and materials; silicon resistor characterization at cryogenic temperatures; chip mounting; and frequency response optimization.
Document ID
19840024710
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Anderson, P. J.
(Honeywell, Inc. Minneapolis, MN, United States)
Nussbaum, P.
(Honeywell, Inc. Minneapolis, MN, United States)
Gustafson, G.
(Honeywell, Inc. Minneapolis, MN, United States)
Date Acquired
September 4, 2013
Publication Date
April 1, 1984
Subject Category
Instrumentation And Photography
Report/Patent Number
MPR-7
NAS 1.26:171125
NASA-CR-171125
Report Number: MPR-7
Report Number: NAS 1.26:171125
Report Number: NASA-CR-171125
Accession Number
84N32781
Funding Number(s)
CONTRACT_GRANT: NAS8-34769
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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