Contamination Measurements During Ius Thermal Vacuum Tests in A Large Space Chamber

The levels of contamination that originate from inside the IUS equipment support section (ESS) due to outgassing from electronics components and wiring operating at elevated temperatures (80-160 F) were investigated. Pressure was measured inside and outside the ESS. Mass deposition measurements were made with quartz crystal microbalances (QCM) facing into and away from ESS vents. The OCM's were operated at -50 C and -180 C using thermoelectrically and cryogenically cooled QCM's. Gaseous nitrogen flow inside the ESS was used to obtain the effective molecular flow vent area of the ESS, which was evaluated to be 359 sq cm (56 sq in) compared to the 978 sq cm (150 sq in) estimated by an earlier atmosphere pressure billowing test. The total outgassing rate of the ESS materials at a temperature of 60 C (140 F) decays with a time constant of 11.5 hours based on pressure measurements during the hot cycle. A time constant of 22 hours was estimated for the fraction of the outgassing which will condense on a -50 C surface. In contrast, the time constant is only 10.1 hours for the outgassing material which condenses on a surface at -180 C. A surface at -180 C collects approximately one half of the material vented from the ESS which impinges on it. Pressure measurements show very good correlation with the mass deposition measurements.