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Capillary Pump Loop (CPL) heat pipe development status reportThe capillary pump loop (CPL) was re-introduced as a potential candidate for the management of large heat loads. It is currently being evaluated for application in the thermal management of large space structures. Test efforts were conducted to establish the feasibility of the CPL heat pipe design.
Document ID
19850009014
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Date Acquired
September 5, 2013
Publication Date
August 1, 1982
Subject Category
Fluid Mechanics And Heat Transfer
Report/Patent Number
NASA-CR-175273
NAS 1.26:175273
Report Number: NASA-CR-175273
Report Number: NAS 1.26:175273
Accession Number
85N17323
Funding Number(s)
CONTRACT_GRANT: NAS5-26660
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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