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Ingot slicing machine and methodAn improved method for simultaneously slicing one or a multiplicity of boules of silicon into silicon wafers is described. A plurality of vertical stacks of horizontal saw blades of circular configuration are arranged in juxtaposed coaxial alignment. Each blade is characterized by having a cutting diameter slightly greater than the cutting diameter of the blade arranged immediately above, imparting a simultaneous rotation to the blades.
Document ID
19850013340
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Kuo, Y. S. (JPL California Inst. of Tech., Pasadena, United States)
Date Acquired
August 12, 2013
Publication Date
October 9, 1984
Subject Category
Mechanical Engineering
Report/Patent Number
NAS 1.71:NPO-15483-1
Patent Application Number: US-PATENT-APPL-SN-387648
Report Number: NAS 1.71:NPO-15483-1
Patent Number: NASA-CASE-NPO-15483-1
Patent Number: US-PATENT-4,475,527
Accession Number
85N21650
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-NPO-15483-1|US-PATENT-4,475,527
Patent Application
US-PATENT-APPL-SN-387648

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