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Adhesive evaluation of LARC-TPI and a water-soluble version of LARC-TPIThe results of a study to evaluate two Langley Research Center thermoplastic polimide (TPI) materials, identified as TPI/MTC for the material from Mitsui Toatsu Chemicals Inc. and TPI/H2O for the material from United Technologies Research Center, as high temperature thermoplastic adhesives and primers for bonding titanium (6AL-4V) adherends are discussed. A limited characterization of the materials was performed using a Diffuse Reflectance-Fourier Transform Infrared Spectroscopy (DR-FTIR) technique. Thermomechanical Analysis (TMA) and torsional braid techniques were used to determine glass transition temperature. The adhesive's strength, as determined by simple lap shear tests, as used to evaluate the effects of long term thermal exposure (up to 1000 hrs) at 204 deg C and a 72-hour water-boil.
Document ID
19850021824
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Progar, D. J.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 5, 2013
Publication Date
May 1, 1985
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-TM-86428
NAS 1.15:86428
Report Number: NASA-TM-86428
Report Number: NAS 1.15:86428
Accession Number
85N30136
Funding Number(s)
PROJECT: RTOP 505-33-33-09
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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