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Hot-Gas Nozzle for Desoldering Leadless IC'sSimple hand-held tool removes leadless, surface-mounted integrated circuits (IC's) from printed-circuit boards. Nozzle used with hot-air gun of type used to apply heat-shrink tubing or with some other source of hot gas. Rectangular end of nozzle and deflector shape airflow pattern to concentrate heat directly on soldering pads located around edge of IC's to heat them quickly and uniformly.
Document ID
19870000368
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Hanlon, Mark T.
(Caltech)
Deering, Robert M.
(Caltech)
Date Acquired
August 13, 2013
Publication Date
July 1, 1987
Publication Information
Publication: NASA Tech Briefs
Volume: 11
Issue: 7
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
ISSN: 0145-319X
Report Number: NPO-16897
NPO-16897
Accession Number
87B10368
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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