Investigation of the effects of short chain processing additives on polymers

The effects of low level concentrations of several short chain processing additives on the properties of the 4,4'-bis(3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA)/4,4'-diaminodiphenyl ether (ODA)/1,3'-diaminobenzene (m-phenylene diamine) (MPA) (422) copolyimide were investigated. It was noted that 5 percent MPD/phthalic anhydride (PA) is more effective than 5 percent ODA/PA and BDSDA/aniline (AN) in strengthening the host material. However, the introduction of 10 percent BDSDA/AN produces disproportionately high effects on free volume and free electron density in the host copolyimide.