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Module encapsulation technologyThe identification and development techniques for low-cost module encapsulation materials were reviewed. Test results were displayed for a variety of materials. The improved prospects for modeling encapsulation systems for life prediction were reported.
Document ID
19870006998
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Willis, P. (Springborn Labs., Inc. Enfield, CT, United States)
Date Acquired
September 5, 2013
Publication Date
January 1, 1986
Publication Information
Publication: JPL, California Inst. of Tech., Pasadena Proceedings of the 26th Project Integration Meeting
Subject Category
Energy Production And Conversion
Accession Number
87N16431
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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