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Adhesive evaluation of water-soluble LARC-TPIThe water-soluble polyimide, identified as TPI(MTC)/H2O, was evaluated as a high temperature thermoplastic adhesive for bonding Ti-6Al-4V and comparing those results primarily with results reported in earlier work with the polyamic-acid/diglyme material. The lap shear strength test was the primary test performed to evaluate the adhesive before (controls) and after thermal exposure in air at 204 C for up to 5000 hours and after a 72 hour water-boil exposure. Lap shear strengths were determined at RT, 177, 204, and 232 C. The adhesive was also characterized after fracture by determining the glass transition temperature as well as defining the mode of failure by visual observation. In general, the results indicate that the TPI(MTC)/H2O retains high lap shear strengths after thermal exposure but had reduced strengths after the water-boil exposure. All failures were cohesive. The TPI(MTC)/H2O compared very well with previous data reported for the standard polyamic-acid/diglyme LARC-TPI results, and therefore, shows promise as a water-soluble adhesive for use in various applications.
Document ID
19870014319
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Progar, Donald J.
(NASA Langley Research Center Hampton, VA, United States)
Pike, Roscoe A.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 5, 2013
Publication Date
June 1, 1987
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-TM-89152
NAS 1.15:89152
Report Number: NASA-TM-89152
Report Number: NAS 1.15:89152
Accession Number
87N23752
Funding Number(s)
PROJECT: RTOP 505-63-01-01
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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