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Additives Improve Processing Of PolyimidesMelt-processable polyimides maintain desirable polymer properties prepared by adding small amounts of certain low-molecular-weight, thermally stable additives. Useful in preparing void-free polyimide composites from higher flow resins that wet out fibers at lower processing temperatures. Applied to preparing high-temperature polyimide adhesives allowing enhanced wetting of adherends and ultimately better adhesion. Improvement to processing polyimides and potential application for production of films, coatings, adhesives, and composites.
Document ID
19880000526
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
St. Clair, Terry L.
(NASA Langley Research Center, Hampton, VA.)
Burks, Harold D.
(NASA Langley Research Center, Hampton, VA.)
Stoakley, Diane M.
(NASA Langley Research Center, Hampton, VA.)
Pratt, J. Richard
(PRC Kentron, Inc.)
Date Acquired
August 13, 2013
Publication Date
November 1, 1988
Publication Information
Publication: NASA Tech Briefs
Volume: 12
Issue: 10
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
LAR-13669
ISSN: 0145-319X
Report Number: LAR-13669
Accession Number
88B10526
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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