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Thermal stress analysis of space shuttle orbiter subjected to reentry aerodynamic heatingA structural performance and resizing (SPAR) finite-element computer program and NASA structural analysis (NASTRAN) finite-element computer programs were used in the thermal stress analysis of the space shuttle orbiter subjected to reentry aerodynamic heating. A SPAR structural model was set up for the entire left wing of the orbiter, and NASTRAN structural models were set up for: (1) a wing segment located at midspan of the orbiter left wing, and (2) a fuselage segment located at midfuselage. The thermal stress distributions in the orbiter structure were obtained and the critical high thermal stress regions were identified. It was found that the thermal stresses induced in the orbiter structure during reentry were relatively low. The thermal stress predictions from the whole wing model were considered to be more accurate than those from the wing segment model because the former accounts for temperature and stress effects throughout the entire wing.
Document ID
19880001007
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Ko, William L.
(NASA Hugh L. Dryden Flight Research Center Edwards, CA, United States)
Fields, Roger A.
(NASA Hugh L. Dryden Flight Research Center Edwards, CA, United States)
Date Acquired
September 5, 2013
Publication Date
October 1, 1987
Subject Category
Structural Mechanics
Report/Patent Number
H-1400
NAS 1.15:88286
NASA-TM-88286
Report Number: H-1400
Report Number: NAS 1.15:88286
Report Number: NASA-TM-88286
Accession Number
88N10389
Funding Number(s)
PROJECT: RTOP 505-53-51
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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