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High temperature be panel developmentBeryllium materials have been used for many aerospace applications over the years. Most of these applications have been fairly ambient environments. The possibility of fabricating beryllium panels for high temperature applications up to 1200 F is investigated. Joining alloys were reviewed, tested and evaluated for high temperature applications.
Document ID
19890016678
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Hardesty, R. (Electrofusion Corp. Fremont, CA, United States)
Jensen, M. (Electrofusion Corp. Fremont, CA, United States)
Grant, L. (Electrofusion Corp. Fremont, CA, United States)
Date Acquired
September 6, 2013
Publication Date
May 1, 1989
Subject Category
Composite Materials
Report/Patent Number
NAS 1.26:181777
NASA-CR-181777
L-11737
Report Number: NAS 1.26:181777
Report Number: NASA-CR-181777
Report Number: L-11737
Accession Number
89N26049
Funding Number(s)
CONTRACT_GRANT: NAS1-18613
PROJECT: RTOP 505-80-31-02
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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