Nonintrusive method and apparatus for monitoring the cure of polymeric materials

The invention is a nonintrusive method of monitoring the cure of a polymeric material using an electromagnetic field to sense a change of resistance of the polymeric material in the electromagnetic field that occurs during curing. This change of resistance is used to vary the impedance of an alternating voltage power supply that produces the electromagnetic field and which change of impedance is measured periodically or continuously to monitor the cure of said polymeric material. The apparatus for practicing the method of this invention may include a nonintrusive sensing head providing an inner, electromagnetic core within an open ended outer pot formed of magnet material. The open end of the pot core is positioned from a selected area of the surface of a sheet of the polymeric material. An alternating voltage supply circuit includes an inductance coil around the electromagnetic core and capacitor connected in parallel with the inductance coil forms a resonant tank circuit when energized. The resulting change in resistance of the polymeric material opposite the open end, a function of the curing, is measured as a corresponding change in the impedance of the power supply circuit to thereby monitor the cure of the polymeric material in the selected area.