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Dielectric function of InGaAs in the visibleMeasurements are reported of the dielectric function of thermodynamically stable In(x)Ga(1-x)As in the composition range 0.3 equal to or less than X = to or less than 0.7. The optically thick samples of InGaAs were made by molecular beam epitaxy (MBE) in the range 0.4 = to or less than X = to or less than 0.7 and by metal-organic chemical vapor deposition (MOCVD) for X = 0.3. The MBE made samples, usually 1 micron thick, were grown on semi-insulating InP and included a strain release structure. The MOCVD sample was grown on GaAs and was 2 microns thick. The dielectric functions were measured by variable angle spectroscopic ellipsometry in the range 1.55 to 4.4 eV. The data was analyzed assuming an optically thick InGaAs material with an oxide layer on top. The thickness of this layer was estimated by comparing the results for the InP lattice matched material, i.e., X = 0.53, with results published in the literature. The top oxide layer mathematically for X = 0.3 and X = 0.53 was removed to get the dielectric function of the bare InGaAs. In addition, the dielectric function of GaAs in vacuum, after a protective arsenic layer was removed. The dielectric functions for X = 0, 0.3, and 0.53 together with the X = 1 result from the literature to evaluate an algorithm for calculating the dielectric function of InGaAs for an arbitrary value of X(0 = to or less than X = to or less than 1) were used. Results of the dielectric function calculated using the algorithm were compared with experimental data.
Document ID
19900017367
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Alterovitz, S. A.
(NASA Lewis Research Center Cleveland, OH., United States)
Sieg, R. E.
(Cleveland State Univ. OH., United States)
Yao, H. D.
(Nebraska Univ. Lincoln., United States)
Snyder, P. G.
(Nebraska Univ. Lincoln., United States)
Woollam, J. A.
(Nebraska Univ. Lincoln., United States)
Pamulapati, J.
(Michigan Univ. Ann Arbor., United States)
Bhattacharya, P. K.
(Michigan Univ. Ann Arbor., United States)
Sekula-Moise, P. A.
(Spire Corp. Bedford, MA., United States)
Date Acquired
September 6, 2013
Publication Date
January 1, 1990
Subject Category
Solid-State Physics
Report/Patent Number
NAS 1.15:103246
E-5672
NASA-TM-103246
Meeting Information
Meeting: International Conference on Electronic Materials
Location: Newark, NJ
Country: United States
Start Date: September 17, 1990
End Date: September 19, 1990
Sponsors: Materials Research Society
Accession Number
90N26683
Funding Number(s)
CONTRACT_GRANT: NAG3-988
PROJECT: RTOP 506-44-21
CONTRACT_GRANT: NAS3-25867
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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