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Processable polyimide adhesive and matrix composite resinA high temperature polyimide composition prepared by reacting 4,4'-isophthaloyldiphthalic anhydride with metaphenylenediamine is employed to prepare matrix resins, adhesives, films, coatings, moldings, and laminates, especially those showing enhanced flow with retention of mechanical and adhesive properties. It can be used in the aerospace industry, for example, in joining metals to metals or metals to composite structures. One area of application is in the manufacture of lighter and stronger aircraft and spacecraft structures.
Document ID
19910006090
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Pratt, J. Richard
(NASA Langley Research Center Hampton, VA, United States)
St.clair, Terry L.
(NASA Langley Research Center Hampton, VA, United States)
Progar, Donald J.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 14, 2013
Publication Date
June 26, 1990
Subject Category
Nonmetallic Materials
Report/Patent Number
Patent Number: NASA-CASE-LAR-14101-1
Patent Number: US-PATENT-4,937,317
Patent Application Number: US-PATENT-APPL-SN-266045
Accession Number
91N15403
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LAR-14101-1|US-PATENT-4,937,317
Patent Application
US-PATENT-APPL-SN-266045
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