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Laterally stacked Schottky diodes for infrared sensor applicationsLaterally stacked Schottky diodes for infrared sensor applications are fabricated utilizing porous silicon having pores. A Schottky metal contract is formed in the pores, such as by electroplating. The sensors may be integrated with silicon circuits on the same chip with a high quantum efficiency, which is ideal for IR focal plane array applications due to uniformity and reproducibility.
Document ID
19910012121
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Lin, True-Lon
(Jet Propulsion Lab. California Inst. of Tech., Pasadena., United States)
Date Acquired
August 14, 2013
Publication Date
February 5, 1991
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
Patent Number: NASA-CASE-NPO-17426-1-CU
Patent Number: US-PATENT-4,990,988
Patent Application Number: US-PATENT-APPL-SN-363815
Accession Number
91N21434
Funding Number(s)
CONTRACT_GRANT: NAS7-918
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-NPO-17426-1-CU|US-PATENT-4,990,988
Patent Application
US-PATENT-APPL-SN-363815
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