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Chemical compatibility issues related to use of copper as an interfacial layer for SiC fiber reinforced Ti3Ai+Nb compositeThe reaction of Cu, a potential interfacial compliant layer for the Ti3Al plus Nb/SiC composite, with SiC, SCS-6 fiber, and the Ti3Al plus Nb matrix was examined at two temperatures: 1223 and 1273 K. Reaction of Cu with SiC resulted in the formation of a CuSi solution and free carbon, the reaction product being molten at 1273 K. Hot pressing the SCS-6 fiber in a Cu matrix at 1273 K resulted in cracking and delamination of the outer carbon-rich coating, thus allowing the Cu to penetrate to the SiC-carbon coating interface and react with SiC. In contrast, no such damage to the outer coating was observed at 1223 K. There was excessive reaction between Cu and the Ti3Al plus Nb matrix, the reaction product being molten both at 1223 and 1273 K. An interlayer of Nb between Cu and Ti3Al plus Nb matrix prevented the reaction between the two.
Document ID
19910015880
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Misra, Ajay K.
(Sverdrup Technology, Inc. Brook Park, OH, United States)
Date Acquired
September 6, 2013
Publication Date
June 1, 1991
Subject Category
Composite Materials
Report/Patent Number
NASA-CR-187100
E-6143
NAS 1.26:187100
Report Number: NASA-CR-187100
Report Number: E-6143
Report Number: NAS 1.26:187100
Accession Number
91N25194
Funding Number(s)
CONTRACT_GRANT: NAS3-25266
PROJECT: RTOP 510-01-05
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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